I'm building up the Speedball and have a couple of questions regarding soldering/desoldering (unfortunately). First, should the solder joint for the PCB go all the way through the hole on the board? For example, if I am soldering from the bottom, should the solder flow all the way through the hold onto the component above (a little)? Or am I just trying to solder it to the pad? If not, is it still a good joint?
Then regarding desoldering, I'm trying to use a desoldering braid (Chem-Wik). It seems that I have to hold it between the iron and the board for a very long time to try to get it to work and I'm afraid of damaging the board. I'm using a Hakko and soldering on the board at 660 degrees. When I built the Crack I soldered at 670 degrees. It seems that maybe I don't have the iron hot enough? I also have a solder sucker, which works pretty well, but is hard to use in some of the small places on the board. I've watched videos and they make it look so easy. You just heat the braid up and presto the solder magically wicks away.
So far, I like building the Crack better...