Okay. I've done some very rough heat dissipation calculations.
I started from the following formula set out in the Ohmite heatsink datasheet:
TJ = TA + PD (θJC + θCH + θHA)
where,
TJ is junction temperature,
TA is ambient temperature,
PD is the power consumption,
θJC is thermal resistance of junction to case (stated on datasheet to be 0.7 C/W)
θCH is thermal resistance from case to heatsink - I'm assuming this is the thermal resistance of the insulator
θHA is the thermal resistance of heatsink to ambient air
I've also made three simplifying assumptions:
(1) that TA (ambient air temp) is the same in the stock BP as in my future rebuild. I think this is a conservative assumption since I will be adding a lot of vent holes on the top plate around the tubes and the pc boards, the new chassis is much larger than stock and will have more open space, there will be at least an inch air gap at the bottom of the chassis (min 1 in feet), and the two 140mm x 140 mm fans will draw cooler air from outside the chassis
(2) that the total difference between Vin and Vout is dropped by the LM1085
(3) that the reg board draws a current of
0.5A [correction: 0.05A] in addition to the current drawn by the filament (this seems high - but I figure it will do for rough calculations) and that all current passes through the LM1085
Assuming the above, this means I need only compare PD * θ-total for stock and rebuild.
Stock w/ Regular 300B w/1.2A fil current θJC (junction to case) = 0.7 C/W (from datasheet)
θCH (case to heatsink) = 0.5 C/W (can’t find hard figures – 0.5 was the lowest stated I found for a mica insulator w/o thermal grease/paste)
θHA (heatsink to ambient) = 3.5 C/W @ 100 linear feet per minute (can’t find estimate for natural convection, so I am using 100 lfm from the heatsink datasheet, which is the lowest forced air rate indicated – this seems high to me)
So PD (θJC + θCH + θHA) = 3.5 * 1.25 * (0.7 + 0.5 + 3.5)
= 20.56
Rebuild w/ EML 300B w/ 1.3A fil currentθJC (junction to case) = 0.7 C/W
θCH (case to heatsink) = 0.09 C/W (thermal resistance of Keratherm Red. This seemed insanely low to me until I check the thermal resistance of Kerafol's other types of Keratherm insulator pads. Red is their best. Their worst thermal performer is "Keratherm Brown" @ 0.44 C/W, - so I am inclined to trust the specs)
θHA (heatsink to ambient) = 2.5 C/W @ 200 lfm (reduced from my calculated 291 linear feet per minute which gives 2 C/W - just to be conservative)
PD (θJC + θCH + θHA) = 4 * 1.35 * (0.7 + 0.1 + 2.5)
= 17.82
So, based on this admittedly rough estimate it looks to me like it might work.
If I've mucked this up, I'd appreciate someone telling me
cheers and thanks, Derek